| System | Applications |
| BIS/ASC/801 | Low viscosity hot curing solvent free system. Used for G-11 laminates |
| BIS/ASC/802 | General purpose laminating system with good electrical and mechanical properties with high HDT |
| BIS/ASC/803 | Offers easy mixing & longer potlife at room temperature. Used in laminates, smaller castings & pultrusions |
| BIS/ASC/804 | Laminating systems for pultrusion |
| BIS/ASC/805 | Offers easy mixing & longer potlife at room temperature. Used in laminates, smaller castings & pultrusions |
| BIS/ASC/806 | For Mica Tapes manufacturing |
| BIS/ASC/807 | Low viscosity, solvent free epoxy laminating system for glass, aramid, carbon fiber by hand lay-up resin transfer moulding, press moulding and filament winding systems. Good mechanical strength both static and dynamic. |
| BIS/ASC/808 | Laminating system for Boat building applications |
| BIS/ASC/809 | Laminates offer excellent dynamic mechanical properties. Suitable for hand lay-up match die moulding vacuum, bag mold etc. can be used for sport goods, auto components, gliders, windmill blades etc |
